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Pad Pitch:
up to 8pins
0.50mm or 0.65mm pitch
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Hole Diameter:
0.047" (1.2mm)
plated holes
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T/H Pad:
0.08" (2.032mm)
round pads
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Hole Spacing:
0.1" (2.54mm)
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Type:
FR-4
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Finish:
Electroless Nickel
Immersion Gold (ENIG) |
PCB Thickness:
0.062" (1.57mm)
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Mounting Holes:
4-40 size, plated
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The SC70 prototyping boards are designed to allow quick and easy circuit prototyping of SC70 chips with up to 8 pins. The board features a 0.50mm pitch footprint on one side and a 0.65mm pitch footprint on the other. The boards also offer 0.08” round pads with 0.047“ plated holes spaced 0.1” apart which can be used to solder DIP headers or wires to interface with the chip. The spacing of the holes also allows the boards to be connected to a standard 0.1” pitch bread-board with ease.
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Datasheet
PT-SC70 Data Sheet
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