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Pad Pitch:
3-8pins
0.95mm
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Hole Diameter:
0.047" (1.2mm)
plated holes
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T/H Pad:
0.08" (2.032mm)
round pads
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Hole Spacing:
0.1" (2.54mm)
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Type:
FR-4
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Finish:
Electroless Nickel
Immersion Gold (ENIG) |
PCB Thickness:
0.062" (1.57mm)
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Mounting Holes:
4-40 size, plated
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The SOT23 prototyping boards are designed to allow quick and easy circuit prototypingof SOT23 chips ranging between 3 and 8 pins. The boards also offer 0.08” round padswith 0.047“ plated holes spaced 0.1” apart which can be used to solder DIP headers orwires to interface with the chip. The spacing of the holes also allows the boards to beconnected to a standard 0.1” pitch bread-board with ease.
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Datasheet
PT-SOT23 Data Sheet
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