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TSSOP Pad Pitch:
0.65mm
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Hole Diameter:
0.047" (1.2mm)
plated holes
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T/H Pad:
0.08" (2.032mm)
round pads
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Hole Spacing:
0.1" (2.54mm)
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Type:
FR-4
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Finish:
Electroless Nickel
Immersion Gold (ENIG) |
PCB Thickness:
0.062" (1.57mm)
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Mounting Holes:
4-40 size, plated
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The TSSOP prototyping boards are designed to allow quick and easy circuit prototyping of TSSOP chips with a center pad. The boards also offer 0.08” round pads with 0.047“ plated holes spaced 0.1” apart which can be used to solder DIP headers or wires to interface with the chip. The spacing of the holes also allows the boards to be connected to a standard 0.1” pitch bread-board with ease.
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Datasheet
PT-TSSOP-EP Data Sheet
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